12 Bump

1 Die Bump Count 12 Bump Pitch 0.4mm Characteristics 16 Site, 2-Die Skip, Mix Probe Type(Kelvin+Non Kelvin) 

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3600 Bump (More than 28000 Pin)

1 Die Bump Count 3600 Bump (More than 28000 Pin) Pitch 0.14mm Characteristics 8 Site, No Skip, Cobra type

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3600 Bump

1 Die Bump Count 3600 Bump Pitch 0.092mm Characteristics 1 Site, Spring Contact, Cobra type

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40QFN

Package Type 40QFN Pitch 0.5mm Characteristics 25GHz Bandwidth, Air Coaxial Type

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30QFN

Package Type 30QFN Pitch 0.60mm Characteristics 20GHz Bandwidth, Air Coaxial Type

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12QFN- WHITE

Package Type 12QFN Pitch 0.35mm Characteristics 15GHz Bandwidth, Air Coaxial Type

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12QFN - BLACK

Package Type 12QFN Pitch 0.35mm Characteristics 15GHz Bandwidth, Air Coaxial Type

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5LGA

Package Type 5LGA Pitch 0.5mm Characteristics 25GHz Bandwidth, Air Coaxial Type

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54WLCSP

Package Type 54WLCSP Pitch 0.3mm Characteristics 3GHz Bandwidth, Air Coaxial Type

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NAND FLASH MEMORY

P/N 48TSOP Pitch 0.5mm Device Spec. 48TSOP-1-20.0X12.4X1.20T Socket Size 28.4X19.0X4.75

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FLOTING TYPE/ DEVICE GUIDE TYPE

P/N 383BGA Pitch 0.4mm Device Spec. 383FBGA-9.0X90X1.18T Socket Size 227.0X17.0X5.40

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GPS TYPE/ GUIDE TYPE

P/N 266BGA Pitch 0.3mm Device Spec. 266FBGA-14.0X16.0X0.62T Socket Size 27.0X17.0X3.75

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